| Customization: | Available |
|---|---|
| Color: | Black |
| Main Raw Material: | Epoxy |
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epoxy under filling adhesive with adjustable viscosity
INTRODUCTION
HQ-124 is a one component, halogen free, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.
|
Chemical Type |
Epoxy |
|
Appearance |
Black liquid |
|
Cure |
Heat cure |
|
Cure Benefit |
Production - high speed curing |
|
Application |
Underfill |
|
Specific Application |
Reworkable underfill for CSP (FBGA) or BGA |
|
Dispense Method |
Syringe |
|
Key Substrates |
SMD components to PCB |
MAIN FEATURES
1) Halogen free
2) Long pot life
3) Two color choice
4) Fast cure, reworkable
5) Low CTE, high reliability
6) Adjustable viscosity, excellent storability
UNCURED PROPERTIES
|
APS HQ-124Y / HQ-124B |
|
|
Appearance |
HQ-124Y: yellow liquid HQ-124B: Black liquid |
|
Viscosity at 25°C / mPa |
Adjustable viscosity: 600-2500 |
|
Density at 25°C / g/cm³ |
1.1-1.2 |
|
Cure condition |
120°C*10min or 150°C*5min |
|
Pot life at 25°C / days |
30 |
|
shelf life at 0-5°C / months |
6 |
|
Package |
10mL, 30mL, 55mL tube |
CURED PROPERTIES
|
APS HQ-124Y / HQ-124B |
|
|
Hardness (Shore D) |
80 |
|
Density at 25°C (g/cm³) |
1.13-1.23 |
|
Shrinkage (%) |
2.5 |
|
Tg by TMA (°C) |
50 |
|
Water absorption 25°C*24h (%) |
0.2 |
|
Elongation at break (%) |
3.6 |
|
Tensile strength (N/mm2) |
20 |
|
Volume resistivity (ohm·cm) |
4.6×1016 |
|
Surface resistivity (ohm) |
1.4×1016 |
Xiamen Aibeisen Electronics Co., Ltd. was established in 2005. It is a National High-tech Enterprise specializing in the research, development, production, sales, and technical services of electronic industrial adhesives, thermal interface materials, and electronic soldering materials.
Advantages
The company collaborates with both the Institute of Chemistry, Chinese Academy of Sciences and the College of Materials Science and Engineering, Xiamen University, jointly establishing an industry-academia-research platform. It also recruits Ph.D. and graduate students from the two research institutes as key technical personnel for the R&D team. With nearly 18 years of development, the company boasts a highly skilled and experienced R&D team, focusing on the research, development, and production of electronic industrial adhesives, thermal interface materials, and soldering materials. It provides customers with solutions, including product development, simulation testing, and adhesive application processes.
Honors & Certifications
The company has earned the title of a "National High-tech Enterprise" and holds multiple invention patents. It has obtained IATF16949, ISO14001, and ISO9001 system certifications, and some of its products have passed UL and SGS testing certifications as well. Additionally, the company is equipped with advanced production equipment and professional testing instruments. With rigorous and scientific management, the company ensures that its products meet customers' quality and technical requirements.
Our Partners Currently, Aibeisen has become a well-known brand both in China and internationally. Aibeisen supplies high-quality products to affiliated companies such as Microsoft, Amazon, Huawei, OPPO, Xiaomi, VIVO, Ford, FLYPRO, Tianma Microelectronics, and CATL. The products find wide-ranging applications in mobile communication, chip packaging, display modules, touch modules, camera modules, motors, fingerprint recognition, automotive applications, and new energy facilities. Management Philosophy Aibeisen consistently adheres to the management philosophies of "Dedication, Innovation, and Quality" and implements a continuous improvement process from research and development to production and technical services. Aibeisen is committed to growing alongside our customers to create a bright future together.
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