Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation

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Product Details
Customization: Available
Application: Automobile, Packing, Electronic Products and Electrical Equipment
Bonding Function: Potting Adhesive
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Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation pictures & photos
Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation pictures & photos
Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation pictures & photos
Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation pictures & photos
Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation pictures & photos
Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation pictures & photos
  • Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
  • Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
  • Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
  • Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
  • Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
  • Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation

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Overview

Basic Info.

Model NO.
EP-106-21
Color
Black
Composition
Organic Material
Morphology
Solvent
Main Raw Material
Epoxy
Other Names
Epoxy Potting
Usage
Potting Pouring Casting
Type
Two Components Epoxy Potting
Mf
Two Components
Material
Epoxy
Promoter Composition
Tackifier
Classification
Epoxy Potting Compound
Main Agent Composition
Epoxy Adhesive
Characteristic
Heat Resistance
Trademark
APS
Origin
Fujian, China
HS Code
3506912000
Production Capacity
1000000/Month

Packaging & Delivery

Package Size
50.00cm * 40.00cm * 30.00cm
Package Gross Weight
5.000kg

Product Description

Epoxy Potting Glue for Electronic Trigger & Electrical Component Encapsulation
Product Description

All the potting compound, white color available!
EP-106A/B is two-part epoxy potting adhesive. This two-component epoxy potting compound is a high-performance room temperature curing adhesive specially designed for electronic insulation and potting protection. Featuring a low mixed viscosity (1300±100 mPa·s) and excellent operability, it can be cured at room temperature or accelerated by heating (60ºC for 1 hour), meeting the diverse production needs of electronic manufacturing.

After curing, it forms a firm solid with 70D Shore hardness, delivering outstanding electrical properties, superior moisture resistance and good thermal conductivity (0.6 W/(m·K)). It provides reliable insulation, waterproof and dustproof protection for electronic components, effectively improving the stability and service life of products in harsh environments. Ideal for the insulation potting of capacitors, transformers, electronic components, triggers, circuit boards, battery packs and other electrical and electronic products, it is a professional potting material for electronic manufacturing and assembly industry.

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Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation

Benefits


1.Excellent Operability & Flexible Curing

2.Superior Electrical Insulation Performance

3.Good Thermal Conductivity & Environmental Resistance

4.Strong Mechanical Properties

5.Precise Mixing Ratio & Stable Performance

6.Safe Use & Convenient Storage

 

Product Parameters
 
Project Parameter
Before curing Surface Group A:Black liquid Group B:dark brown liquid
Density(GB/T  13354-1992,g/cm³) 1.65±0.05 1.05±0.05
Viscosity(GB/T 2794-1995,mPa · s) 10000±2000

(75rpm/25ºC)
50±10

(750rpm/25ºC)
After mixing Mixed weight ratio 5:1
Mixed viscosity(mPa · s,750 rpm/25ºC) 1000-1500
Operable time (min/100g) 25~45
Recommended curing conditions 25ºC×24h
60ºC×1h
After curing Hardness(GB/T 2411-2008,D) 70 
Glass transition temperature (DSC,ºC) 35 
Tensile strength(GB/T1040.2-2006,MPa) 20 
Bending strength(GB/T9341,MPa) 10 
Thermal conductivity(ASTM D5470,W/(m ·K)) 0.6 
Volume resistance(GB/T1410-2006,Ωcm) >1.0*1013
Surface resistance(GB/T 1410-2006,Ω) >1.0*1013
Dielectric strength(GB/T1408.1,KV/mm) >19
Dielectric constant(GB/T 1693,1.2 MHz) 3.8 
 
Application

This high-performance two-component epoxy potting compound is widely used in the electrical and electronic manufacturing industry for insulation, potting, sealing and protection of various electronic components and devices, mainly including:

1.Passive Component Potting - Insulation and moisture-proof potting of capacitors, inductors, transformers and other passive electronic components, improving their environmental adaptability.

2.Printed Circuit Board (PCB) Protection - Potting and sealing of various circuit boards, core control boards and electronic trigger boards to prevent dust, moisture and short circuit.

3.Battery Pack Encapsulation - Insulation and heat dissipation potting of lithium battery packs, lead-acid batteries and other battery products for consumer electronics and industrial equipment.

4.Small Electrical Device Potting - Internal component potting of small electrical appliances, electronic sensors and measuring instruments to enhance structural stability and electrical safety.

5.Automotive Electronic Component Protection - Potting of automotive electronic control modules, ignition devices and on-board sensors, adapting to the complex working environment of vehicles.

6.Industrial Electronic Equipment Encapsulation - Insulation potting of industrial control equipment, power supply modules and frequency converters to ensure stable operation in industrial sites.


Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
 

STORAGE AND NOTE

 

1. This product isn't dangerous goods, so it can be stored as usual goods.

2. Please clean with cleaner if there is some glue bonding to your skin, and then go to hospital.

3. Out of the reach of children.

4. Avoid contact with skin and eyes, especially the component B, in case of contact with eyes, please clean with water, and go to hospital.

5. Please seal well after use.

Company Profile
 

Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component EncapsulationEpoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation

Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
Xiamen Aibeisen Electronics Co., Ltd. was established in 2005. It is a National High-tech Enterprise specializing in the research, development, production, sales, and technical services of electronic industrial adhesives, thermal interface materials, and electronic soldering materialsThe company collaborates with both the Institute of Chemistry, Chinese Academy of Sciences and the College of Materials Science and Engineering, Xiamen University, jointly establishing an industry-academia-research platform. It also recruits Ph.D. and graduate students from the two research institutes as key technical personnel for the R&D team. With 20 years of development, the company boasts a highly skilled and experienced R&D team, focusing on the research, development, and production of electronic industrial adhesives, thermal interface materials, and soldering materials. It provides customers with solutions, including product development, simulation testing, and adhesive application processes.

Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component EncapsulationEpoxy Potting Ab Glue for Electronic Trigger & Electrical Component EncapsulationEpoxy Potting Ab Glue for Electronic Trigger & Electrical Component EncapsulationEpoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation

Certifications

The company has earned the title of a "National High-tech Enterprise" and holds multiple invention patents. It has obtained IATF16949, ISO14001, and ISO9001 system certifications, and some of its products have passed UL and SGS testing certifications as well. Additionally, the company is equipped with advanced production equipment and professional testing instruments. With rigorous and scientific management, the company ensures that its products meet customers' quality and technical requirements.

Our Partners Currently, Aibeisen has become a well-known brand both in China and internationally. Aibeisen supplies high-quality products to affiliated companies such as Microsoft, Amazon, Huawei, OPPO, Xiaomi, VIVO, Ford, FLYPRO, Tianma Microelectronics, and CATL. The products find wide-ranging applications in mobile communication, chip packaging, display modules, touch modules, camera modules, motors, fingerprint recognition, automotive applications, and new energy facilities. Management Philosophy Aibeisen consistently adheres to the management philosophies of "Dedication, Innovation, and Quality" and implements a continuous improvement process from research and development to production and technical services. Aibeisen is committed to growing alongside our customers to create a bright future together.


Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation
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Epoxy Potting Ab Glue for Electronic Trigger & Electrical Component Encapsulation

FAQ

1.Are you trade company or manufacturer?

We are an China professional manufacturer of customized various thermal interface materials,such as silicone insulation conductive pad,thermal conductive tape,thermals conductive graphite etc with more than 20 years experience in this line.

2:How can you guarantee the quality?

With advanced production machine and testing equipment,we ensure 100% quality inspection before shipping.

3:What's the leading time?

Sample order costs 5-7 workdays and 7-10 working days for mass production.

4:Can I take sample?

We are honored to provide you sample for testing.

5:What payment term is available?

We can accept L/C,TT,Paypal.West Union.

Related silicone insulation conductive pad you may interest ,pls feel free to contact with me .

 

 

 

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